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Equipment

Back-end Equipment

Production, inspection and utility equipment across the back end — from wafer processing through packaging, inspection and device programming.

What We Supply

Ordered roughly by process step. Detailed specifications and demonstrations are arranged separately.

Wafer Grinding & Wafer Cutting

Backgrinding and wafer cutting equipment. Selected against the target thickness, the wafer size and what comes next in the process.

Process
Backgrinding, wafer cutting
Consider
Wafer size, target thickness

Precision Dicing Saw

Separates the wafer into individual die. Kerf width, chipping control and throughput drive the selection.

Process
Wafer dicing
Consider
Kerf width, chipping, throughput

Package Saw

Singulates a finished strip into individual packages. Configured for the package form and strip specification.

Process
Package singulation
Consider
Package form, strip specification

Ball Attach System

Places solder balls on BGA and similar packages. Ball size, pitch and placement accuracy are the critical parameters.

Process
Solder ball attach
Consider
Ball size, pitch, placement accuracy

Wafer AOI & Vision Inspection

Automated inspection of wafer surfaces and package appearance. Configuration depends on the defects to be caught, the smallest size that must be detected, and throughput.

Targets
Wafer surface, package appearance
Consider
Defect types, minimum detectable size, throughput

Overlay Metrology

Measures layer-to-layer alignment error. Used for process stability control and yield analysis.

Used for
Layer alignment measurement
Consider
Measurement accuracy, throughput

IC Programmer / Auto Programming System

Writes firmware or data to devices in production. Available from manual programmers through to automated systems with an integrated handler.

Devices
MCU, memory and others
Consider
Device type, throughput, level of automation

IC Tester / Auto Test System

Testers and automated test systems for NOR, NAND, MCU and similar devices. Selected against device type, test items and target throughput.

Devices
NOR, NAND, MCU
Consider
Test items, throughput, handler integration

Ionizer & Smart Nitrogen Controller

Ionizer blowers for static control and controllers that manage a nitrogen atmosphere — used where static or oxidation affects yield.

Used for
Static elimination, nitrogen atmosphere control

Scrubber

Treats process exhaust gas. Selected against the gases involved, the flow rate and the installation environment.

Used for
Process exhaust treatment
Consider
Target gases, flow rate, installation

Useful to Confirm Before Enquiring

  • The process step and the equipment currently in use
  • Wafer size or package form
  • Target throughput (UPH)
  • For inspection, the defects to catch and the minimum detectable size
  • Whether integration with an existing line or handler is needed
  • Floor space and utility requirements
  • Timing and budget range

Where It Is Used

  • Wafer processing (grinding, dicing)
  • Packaging and singulation
  • Visual inspection and metrology
  • Device programming in production
  • Final test and automated test
  • Cleanroom utilities and exhaust treatment

Equipment configurations vary considerably with line conditions, and lead times can be long. Tell us the process and the throughput you are targeting and we will work through a suitable configuration and schedule with you.

Other Categories

Test Sockets & Pogo PinsTest, burn-in, RF and memory sockets Wafer & SubstrateDummy wafer, glass wafer, PCB substrate, FOUP IC ProductsDC/DC, LDO, MCU, communication interface IC

Request a Quote

Tell us the specification and quantity and we will come back to you directly. Drawings or package information help us answer faster.

Email Us

jason@ion-chip.com