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Material

Wafer & Substrate

From the dummy wafers used to set equipment up and monitor a process, through glass wafers and packaging substrate, to the containers that store and move wafers and devices.

What We Supply

Sizes and specifications follow the equipment and the process. These are the categories we supply.

Dummy Wafer

Used to set equipment up, confirm process conditions and monitor particles before production wafers go in. Equipment can be checked without consuming product, which lowers the cost of running a line.

Used for
Equipment setup, process monitoring, particle checks
Consider
Size, thickness, surface condition, resistivity

Glass Wafer

Glass substrate for temporary bonding carriers and optical applications. Flatness, thickness uniformity and transmission matter to different degrees depending on the use.

Used for
Temporary bonding carrier, optical applications
Consider
Size, thickness, flatness, transmission

PCB Substrate

Substrate for semiconductor packages. Specified by package form, layer count and surface finish, and best reviewed together with the package design.

Consider
Package form, layer count, surface finish

Wafer Box / FOUP / FOSB

Containers for storing wafers and moving them between lines. Load port compatibility and particle control drive the choice.

Types
Wafer box, FOUP, FOSB, cassette
Consider
Wafer size, load port fit, cleanliness

IC Tray

Trays that hold and move packaged devices. Selected against package dimensions and the handler or test equipment in use.

Consider
Package dimensions, handler fit, temperature rating

Chemical

Process chemicals supplied alongside. Tell us the application and the conditions and we will point you to a suitable product.

Consider
Application, operating conditions, storage requirements

Useful to Confirm Before Enquiring

  • Wafer size (6", 8", 12" and so on)
  • Thickness and surface condition required
  • For dummy wafers, whether reclaimed material is acceptable
  • Equipment and load port specification
  • Cleanliness class required
  • For IC trays, package dimensions and handler specification
  • Quantity and required delivery date

Where It Is Used

  • Equipment setup and periodic checks
  • Process verification and particle monitoring
  • Temporary bonding and wafer-level packaging
  • Wafer storage and transfer between lines
  • Storage and shipment of packaged devices
  • R&D and pilot lines

Wafers and containers come in many size and specification combinations, so stock and lead time vary by item. Tell us the equipment and the specification you need and we will confirm what is available.

Request a Quote

Tell us the specification and quantity and we will come back to you directly. Drawings or package information help us answer faster.

Email Us

jason@ion-chip.com