Test Socket
Connects the device to the test board during final test. Built for the package type and pin pitch, with handler compatibility considered alongside.
Material
Sockets that connect the device to the test board in final test and burn-in, together with the pogo pins and hardware that carry the repeated contact.
Specifications depend on the package type and process conditions. These are the categories we supply.
Connects the device to the test board during final test. Built for the package type and pin pitch, with handler compatibility considered alongside.
Used in burn-in, where the socket sits at high temperature for long periods. Heat-resistant materials and a structure that survives repeated insertion are what matter.
For RF devices where high-frequency behaviour must be preserved. The design keeps the signal path short and manages impedance matching and loss.
For DRAM, NAND and similar memory devices. High pin counts and high test volumes make durability and serviceability especially important.
Spring-loaded contact pins for sockets and test fixtures where contact is made repeatedly. Stroke, contact force and plating determine life and contact stability.
Stiffeners that fix the socket to the board, and change kits for device changeover. A socket on its own is often not enough to put a line into production.
The above describes the categories and the usual selection criteria. Individual socket specifications follow from the device and the process, so send us the package information and we will propose a suitable specification.
Tell us the specification and quantity and we will come back to you directly. Drawings or package information help us answer faster.
Email Us